Metal target material

Gold (Au) Sputtering Targets offer exceptional electrical conductivity and resistance to corrosion and tarnish. This material is used in a variety of applications, ranging from decorative coating to advanced electronics.

Silver sputtering targets are made of high purity silver, which are used extensively in PVD coating processes. The process involves high-energy ions bombarding the silver target, dislodging silver atoms in the process. These atoms then coat the substrate to form a thin film.

Platinum sputtering targets are fabricated from highly pure platinum. They are widely used in the manufacturing of microelectronics, providing a significant role in creating high-quality thin films in the semiconductor industry. • Application Scope: Microelectronics, Data storage technology, Corrosion-resistant coatings, Fuel cells, and Catalytic converters.

Palladium sputtering targets, produced from highly pure palladium, are utilized extensively in thin film deposition processes, particularly in the electronics and catalysis industries.

Ruthenium (Ru) sputtering targets are made from Ruthenium, a rare transition metal belonging to the platinum group of the periodic table. It has a shiny silver appearance. Sputtering targets made from Ruthenium are used in the manufacturing of high-density and high-performance memory chips in the semiconductor industry due to its excellent electrical properties.

Iridium (Ir) sputtering targets are thin, pure iridium metallic layers used in the fabrication of thin film devices. This thin film process, called sputtering, involves bombarding a solid iridium target with high-energy particles, causing atoms to be ejected from the target. The atoms then deposit onto a substrate forming a thin film. Iridium, being one of the densest and most corrosion-resistant metals, provides excellent qualities for various thin film applications.

Aluminum (Al) sputtering targets are widely used in the thin-film deposition of various material layers. Sputtering involves ejecting material from a "target" (in this case, aluminum) that is to be deposited on a substrate (such as a silicon wafer). Aluminum is a light, strong, and highly conductive metal, making it an excellent sputtering target.

Copper (Cu) sputtering targets are a key material in the thin-film coating industry, primarily for their superior electrical and thermal conductivity. Composed of high purity copper, these targets are used for the fabrication of thin films in various electronic devices, enabling high-speed data transmission and efficient heat dissipation.

Titanium (Ti) sputtering targets are used in the deposition of titanium thin films. Titanium is a strong, lightweight, and highly corrosion-resistant metal. It is an ideal material for a wide range of thin film applications including semiconductors, decorative coatings, and medical devices.

Nickel (Ni) sputtering targets are primarily used in the manufacturing of thin films via physical vapor deposition (PVD). Nickel is a hard, malleable, ductile metal with high heat and electrical conductivity, making it an excellent choice for a wide range of applications.

Chromium (Cr) sputtering targets are used to deposit chromium thin films. Chromium is a hard, brittle metal known for its high melting point and corrosion resistance. It is widely used in the thin film industry for its excellent metallic properties.

Cobalt (Co) sputtering targets are used in the deposition of cobalt thin films. Cobalt is a hard, lustrous, silver-gray metal known for its magnetic properties and high temperature stability, making it an ideal material for various thin film applications.

Iron (Fe) sputtering targets are used to deposit iron thin films. Iron is a strong, hard metal with magnetic properties, making it an ideal material for various thin film applications.

Manganese (Mn) sputtering targets are used in the deposition of manganese thin films. Manganese is a hard, brittle metal known for its high melting point and oxidation resistance, making it an ideal material for various thin film applications.

Zinc (Zn) sputtering targets are used to deposit zinc thin films. Zinc is a moderately reactive, blueish-white metal that tarnishes in moist air and burns in air with a bright, bluish-green flame. It is used in a variety of thin film applications.

Vanadium (V) sputtering targets are used in the deposition of vanadium thin films. Vanadium is a hard, silvery-grey, ductile, and malleable transition metal. It has good resistance to corrosion and it is stable against alkalis, sulfuric and hydrochloric acid.

Tungsten (W) sputtering targets are renowned for their high melting point, strength, and density. Being a versatile refractory metal, tungsten targets find their usage in a wide range of thin film applications such as microelectronics, solar cells, and decorative coatings.

Hafnium (Hf) sputtering targets are used in the deposition of hafnium-based thin films. These targets are known for their high temperature resistance and are often used in applications such as integrated circuits, fiber optic cables, and thermal neutron absorbers in nuclear reactors.

Niobium (Nb) sputtering targets are used for depositing niobium-based thin films. Known for their superior superconducting properties, these targets are widely used in applications such as superconducting magnets, electronic devices, and optical coatings.

Molybdenum (Mo) sputtering targets are known for their high melting point and excellent thermal and electrical conductivity. They find widespread use in the electronics industry, particularly in the manufacture of thin-film transistors, integrated circuits, and solar cells.

Lanthanu m (La) sputtering targets are used for depositing lanthanu m-based thin films. They are known for their high refractive index and are used in a variety of applications such as optical coatings, phosphors, and catalysts.

Cerium (Ce) sputtering targets are used for depositing cerium-based thin films. Known for their excellent oxidation resistance, these targets are used in a wide array of applications, including catalysts, optical coatings, and fuel cells.

Praseodymium sputtering targets are used for depositing praseodymium-based thin films. They are usually applied in the production of color glasses and ceramics, magnet alloys, and certain types of steel.

Neodymium sputtering targets are utilized in the production of Neodymium-based thin films. The applications often include color glasses, lasers, and magnet alloys.

Samarium sputtering targets are used for the deposition of Samarium-based thin films. They find applications in the production of magnets, lasers, and nuclear reactors.

Europium sputtering targets are used for depositing Europium-based thin films. Their applications include phosphors, lasers, and nuclear reactors.

Gadolinium sputtering targets are used for the deposition of Gadolinium-based thin films. They find application in magnetic resonance imaging (MRI), computer memory, and shielding in nuclear reactors.

Terbium sputtering targets are used for depositing Terbium-based thin films. They are widely used in phosphors, magnets, and lasers.

Dysprosium sputtering targets are used for the deposition of Dysprosium-based thin films. They find extensive application in the production of lasers, magnets, and nuclear reactors.

Holmium sputtering targets are used for depositing Holmium-based thin films. They are applied in the manufacturing of magnets, lasers, and medical devices.

Erbium sputtering targets are used for depositing Erbium-based thin films. They find applications in lasers, especially fiber-optic communication systems, and medical devices.

Thulium sputtering targets are used for depositing Thulium-based thin films. They are used in the production of lasers, particularly portable X-ray machines, and medical devices.

Ytterbium sputtering targets are used for depositing Ytterbium-based thin films. They find applications in lasers, chemical reactions catalysts, and stainless steel.

Lutetium sputtering targets are used for depositing Lutetium-based thin films. They are widely used in the production of phosphors, PET scanners, and catalysts.