Nitride target material

Boron nitride (BN) sputtering targets are used in the deposition of hard, lubricious, and chemical-resistant boron nitride films. These targets are known for their high purity, uniform grain structure, and optimal deposition rates.

Aluminum nitride (AlN) sputtering targets are highly valued for their excellent thermal conductivity and electrical insulation properties. They are widely used in the production of electronic devices, such as power modules, LEDs, and microwave components.

Silicon nitride (Si3N4) sputtering targets are widely used for the deposition of thin films with excellent mechanical and thermal properties. They find applications in the production of cutting tools, wear-resistant coatings, and protective films due to their high hardness and chemical resistance.

Titanium nitride (TiN) sputtering targets are widely utilized for the deposition of hard and wear-resistant coatings. They find applications in the aerospace, automotive, and cutting tool industries due to their exceptional hardness, high melting point, and excellent adhesion.

Zirconium nitride (ZrN) sputtering targets are valued for their exceptional hardness, thermal stability, and resistance to wear and corrosion. They are extensively used in the production of decorative coatings, cutting tools, and wear-resistant components.

Tantalum nitride (TaN) sputtering targets are known for their exceptional thermal and chemical stability, making them suitable for various high-temperature applications. They are widely used in the production of barrier layers, diffusion barriers, and metal contacts in semiconductor devices.