Gallium nitride (GaN)

Gallium nitride (GaN) is a direct bandgap semiconductor material with a bandgap width of approximately 3.4 eV. Therefore, it has high luminous efficiency in both the ultraviolet and visible spectral regions and is widely used in the manufacturing of blue and white light emitting diodes (LEDs) and laser diodes (LDs). In addition, GaN also has good thermal stability, large breakdown electric field and high electron saturation Drift velocity, making it an ideal material for manufacturing high-power and high-frequency electronic devices, such as microwave RF devices and power electronic devices.

GaN crystal structure is stable, generally Hexagonal crystal family, and its physical properties make it have excellent performance in high temperature, high voltage and radiation environment. Despite the complex preparation process and high production cost of GaN crystals, interest in their research has always been high due to their important applications in the fields of optoelectronics and power electronics.

In the future, with the progress of preparation technology, we can expect the application of GaN crystals in fields such as optoelectronics, power electronics, and wireless communication to further expand. Moreover, due to its broadband gap and high-power characteristics, GaN is expected to play a key role in fields such as new energy vehicles, smart grids, and 5G communication.

Dihedral Tech. Co., Ltd. provides high-quality GaN crystal wafers to customers' requirements.


Dihedral Technology(DHD) Co., Ltd. manufacture and processing/provide multiple specifications and high quality GaN crystal,targets,materials.

Applications

• LED lights: Due to its wide control band characteristics, GAN is widely used to make blue and white LED lights. The efficiency and longevity of these LED lights are superior to traditional light-emitting materials.
• RF (RF) applications: Due to its high electron mobility, GAN has been widely used in RF power amplifiers and RF front-end modules such as radar systems, communication equipment, and wireless base stations.
• Power electronics: GAN has many applications in power conversion and power management systems, such as switching power supplies and electric vehicle power systems.
• Solar cells: GAN's wide control band and high radiation immunity make it an ideal material for manufacturing solar cells, especially those for aerospace applications.
• Laser diodes: GAN can be used to make blue and purple laser diodes. These laser diodes are widely used in display, storage, and medical applications.

Features

Nitride (GAN) is a wide -ranging semiconductor material with many unique physical and electronic characteristics, which makes it have a significant advantage in many fields:

• Broad -band: GAN's banned width is about 3.4 EV, which means that it can withstand the strength of the high -electric field without conducting electricity, so it still maintains good performance under high voltage conditions.
• High electronic migration rate: GAN materials have high electron migration rates, which makes them have excellent performance in high -frequency electronic devices.
• High thermal guidance: GAN can effectively emit heat and help cool the cooling of electronic equipment.
• High intensity and hardness: The GAN material itself is very hard and stable, and it is adapted to work in harsh environments.
High radiation resistance: GAN has a strong resistance to radiation and is suitable for use in high -radiation environments.


  • Items

    Free-standing GaN wafer

    Al2O3 epitaxy with GaN

    Type

    F1010U

    F1015U

    F1010N

    F1015N

    F1010SI

    F1015SI

    F50U

    F50-N

    F50-SI

    F100U

    F100N

     

    U50S

    U100S

    N50S

    N100S

    Size

    10.0×10.5mm2, 10.0×15mm2, Φ50.8mm, Φ100mm,to be customed

    Thickness

    300 ± 25 µm, 350 ± 25 µm, 400 ± 25 µm, to be customed

    Orientation

    C-axis(0001) ± 0.25°

    TTV

    ≤15 µm

    BOW

    ≤20 µm

    Conductivity

    N

    N

    semi-insulate

    customed upon request

    Resistivity(300K)

    <0.5 Ω·cm

    <0.05 Ω·cm

    >106 Ω·cm

    Dislocation density

    from 1 x 105 to 3 x 106 cm-2

    Available surface area

    > 90%

    Polishing

    Front: Ra < 0.2nm. substrate grade;Back: fine grinding