Tantalum Nitride (TaN(T))

Tantalum nitride (TaN) sputtering targets are extensively employed in the production of barrier layers, diffusion barriers, and metal contacts in semiconductor devices. Their remarkable thermal and chemical stability, combined with excellent barrier properties, make them indispensable in industries requiring high-temperature applications. TaN coatings effectively prevent diffusion and enhance the performance and reliability of semiconductor devices. The continuous advancements in semiconductor technologies contribute to the increasing demand for TaN sputtering targets.

Dihedral Technology(DHD) Co., Ltd. manufacture and processing/provide multiple specifications and high quality TaN(T) crystal,targets,materials.

Applications

• Semiconductor Devices
• Barrier Layers
• Diffusion Barriers
• Metal Contacts

Features

• Thermal Stability
• Chemical Stability
• Excellent Barrier Properties