Gallium Indium Tin Zinc Silver (GaInSnZnAg)

Metal thermal paste is made of room temperature liquid metal modified by special process with nanoscale metal particles, which is an ideal thermal conductive material to replace silicone paste. It has excellent thermal and electrical conductivity, as well as good adhesion, high temperature resistance and aging resistance. The product can be applied directly between the heat source and the heat sink to fully fill the gap and take advantage of the high thermal conductivity of metal. At the same time, it does not react with copper and stainless steel, which can realize the safety and service life of the contact device. It has broad application prospects in the fields of circuit printing and solar conductive paste applications.

Dihedral Technology(DHD) Co., Ltd. manufacture and processing/provide multiple specifications and high quality GaInSnZnAg crystal,targets,materials.

Applications

• IGBT and large LED heat dissipation
• Power battery heat dissipation
• CPU/GPU cooling
• Circuit printing and solar conductive paste applications

Features

• 100% metal composition, thermal conductivity of more than 20W/m·K
• Very good adhesion and high temperature resistance
• Adjustable viscosity and flowability, wide operating temperature range
• No solidification at low temperature, no flow, no volatilization, no oxidation, no drying up at high temperature
• Excellent thermal shock resistance and aging resistance
• Ensures adequate interface filling and low thermal resistance
• Does not react with copper and stainless steel, ensuring the safety and service life of the contact device
• High conductivity up to 3.4 x 10^7 S/m
• EU RoHS compliant and non-toxic

  • Component Nanotechnology - GaInSnAg
    Thermal Conductivity >25W/m·K
    Packaging Specification 5g, 10g, 100g
    Electrical Conductivity 3 X 10^6 S/m
    Viscosity 8000 mPa·s
    Operating Temperature -50°C to 600°C
    Evaporation Rate <0.001%
    Corrosiveness Aluminum corrosion