Aluminum Nitride (AlN) crystal/substrate/film

Aluminum nitride (AlN) is a highly promising ultra wide bandgap semiconductor material with many excellent properties, such as a bandgap width of up to 6.2 eV and high

Aluminum nitride has excellent properties such as breakdown field strength, high saturation electron mobility, high chemical and thermal stability, as well as high thermal conductivity and radiation resistance. Therefore, aluminum nitride is a type of ultraviolet/deep ultraviolet LED

UV LD is the best substrate material and also an ideal substrate material for high-power and high-frequency electronic devices. In addition, aluminum nitride has excellent piezoelectricity and a high acoustic surface

The wave propagation speed and high electromechanical coupling coefficient are the preferred piezoelectric materials for GHz level surface acoustic wave devices.

DHD provides customized services for high-quality aluminum nitride (AlN) crystals, substrates, and thin films (silicon based AlN thin films, sapphire based AlN thin films, and diamond based AlN thin films).



Applications

1. High temperature power electronic devices, such as high temperature power amplifiers, switches, and rectifiers.
2. Create UV LEDs. These LEDs have extensive applications in fields such as pollution detection and biosensing.
3. Applications such as wireless communication, sensing, and filters.
4. RF power amplifier, RF switch, and RF filter.
5. Cooling solutions for efficient heat sinks, thermal sensors, and high-power electronic devices.
6. Electronic and photonic integrated devices, such as optoelectronic integrated chips and sensors.
7. Ultrasonic sensors, used in fields such as measurement, detection, and imaging.

Features

1. Aluminum nitride has a large bandgap energy gap, typically between 6 and 6.2 electron volts (eV), which makes it excellent in applications of ultraviolet and deep ultraviolet light.
2. Aluminum nitride has excellent thermal conductivity, usually between 150 and 320 thermal conductivity (W/m · K), which makes it play an important role in high-power electronic devices and thermal management. It can effectively dissipate heat, reduce device temperature, and improve device stability and performance.
3. The high electron mobility of aluminum nitride makes it an ideal material for high-frequency electronic devices. This is particularly important in RF applications, such as RF power amplifiers and RF switches.
4. Good surface acoustic wave performance.
5. Aluminum nitride has good chemical stability, making it suitable for various environments and applications.
6. Due to its wide bandgap, aluminum nitride has potential applications in optical sensors, optical communication, and optical devices.

  • ItemParameters
    Dimension10mm*10mm, 1inch
    Thickness500±50μm or customized
    Orientation<0001>
    Deviation±0.5°
    (002)XRD  FWHM<150 arcsec
    (102)XRD  FWHM<150 arcsec
    PolishingAl--CMP; N--MP
    Roughness (Ra.)<0.3nm
    TTV<10μm




    parameters)

     

    AlN/Si

     

    AlN/Al2O3

     

    AlN/C(Diamond)

     

    Type

     

    AlN on Si-001

     

    AlN on sapphire-002

     

    AIN on diamond-003

     

    Substrate

    500±10μm   Si(111) 

    430-440μm Sap(002)

     

    200μm~500μm;polycrystal

     

    Size(inch),customized

     

    2-4

     

    2-4

     

    10*10mm; 2"

     

    Thickness

     

    5~200nm

     

    5200nm

     

    5200nm

     

    Orientation(Orientation)

     

    c-aixs [0001]

     

    c-aixs [0001]

     

    c-aixs [0001]

     

    Roughness(nm) (5x5μm)

     

    Ra< 1.5nm (200nm)

     

    Ra < 1.2nm (200nm)

     

    Ra < 2nm (200nm)

     

    HRXRD FWHM@(0002)

     

    <0.9 °

     

    <0.05 °

     

    <3°

     

    Warp

     

    <30μm

     

    <30μm

     

    <30μm

     

    Bow

     

    -10 ~15μm

     

    -10 ~15μm

     

    -10 ~15μm

     

    Packaging

     

    wafer cassette

     

    wafer cassette

     

    wafer cassette